8403701CX vs MC74HC03AFR2 feature comparison

8403701CX Intersil Corporation

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MC74HC03AFR2 Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer HARRIS SEMICONDUCTOR ROCHESTER ELECTRONICS INC
Part Package Code DIP SOIC
Package Description DIP, SSOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Length 19.56 mm 6.2 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level NOT APPLICABLE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT APPLICABLE
Propagation Delay (tpd) 135 ns 180 ns
Seated Height-Max 5.08 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Width 7.62 mm 5.3 mm
Base Number Matches 5 2
Output Characteristics OPEN-DRAIN
Qualification Status COMMERCIAL

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