Findchips: Compare 8403701CX vs MM74HC00J

8403701CX vs MM74HC00J feature comparison

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Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	HARRIS SEMICONDUCTOR	NATIONAL SEMICONDUCTOR CORP
Part Package Code	DIP
Package Description	DIP,	DIP, DIP14,.3
Pin Count	14
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-GDIP-T14	R-GDIP-T14
Length	19.56 mm	19.43 mm
Logic IC Type	NAND GATE	NAND GATE
Moisture Sensitivity Level	NOT APPLICABLE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
Package Code	DIP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Peak Reflow Temperature (Cel)	NOT APPLICABLE
Propagation Delay (tpd)	135 ns	23 ns
Seated Height-Max	5.08 mm	5.08 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	NO
Technology	CMOS	CMOS
Temperature Grade	MILITARY	INDUSTRIAL
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Pitch	2.54 mm	2.54 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	NOT APPLICABLE
Width	7.62 mm	7.62 mm
Base Number Matches	7	4
Rohs Code		No
JESD-609 Code		e0
Load Capacitance (CL)		50 pF
Package Equivalence Code		DIP14,.3
Qualification Status		Not Qualified
Schmitt Trigger		NO
Terminal Finish		TIN LEAD
	Logic » Gates	Logic » Gates