8403701CX vs MM74HC00SJ feature comparison

8403701CX Intersil Corporation

Buy Now

MM74HC00SJ Rochester Electronics LLC

Buy Now Datasheet
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer HARRIS SEMICONDUCTOR ROCHESTER ELECTRONICS LLC
Part Package Code DIP SOIC
Package Description DIP, 5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Length 19.56 mm 10.2 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level NOT APPLICABLE 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT APPLICABLE
Propagation Delay (tpd) 135 ns 113 ns
Seated Height-Max 5.08 mm 2.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Width 7.62 mm 5.3 mm
Base Number Matches 5 3
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e3
Terminal Finish MATTE TIN

Compare 8403701CX with alternatives

Compare MM74HC00SJ with alternatives