8403801DA
vs
M54HC10K1
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
STMICROELECTRONICS
|
Reach Compliance Code |
unknown
|
not_compliant
|
Family |
HC/UH
|
HC/UH
|
Length |
8.89 mm
|
9.95 mm
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Moisture Sensitivity Level |
NOT APPLICABLE
|
|
Number of Functions |
3
|
3
|
Number of Inputs |
3
|
3
|
Number of Terminals |
20
|
14
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Style |
CHIP CARRIER
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
NOT APPLICABLE
|
|
Propagation Delay (tpd) |
145 ns
|
110 ns
|
Seated Height-Max |
2.03 mm
|
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT APPLICABLE
|
|
Width |
8.89 mm
|
6.91 mm
|
Base Number Matches |
3
|
1
|
Part Package Code |
|
DFP
|
Package Description |
|
DFP, FL14,.3
|
Pin Count |
|
14
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Samacsys Manufacturer |
|
STMicroelectronics
|
JESD-30 Code |
|
R-CDFP-F14
|
JESD-609 Code |
|
e0
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.004 A
|
Package Code |
|
DFP
|
Package Equivalence Code |
|
FL14,.3
|
Package Shape |
|
RECTANGULAR
|
Packing Method |
|
TR
|
Prop. Delay@Nom-Sup |
|
22 ns
|
Qualification Status |
|
Not Qualified
|
Schmitt Trigger |
|
NO
|
Surface Mount |
|
YES
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
FLAT
|
Total Dose |
|
50k Rad(Si) V
|
|
|
|
Compare 8403801DA with alternatives
Compare M54HC10K1 with alternatives