8409801CA vs HEC4069UBD feature comparison

8409801CA Motorola Mobility LLC

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HEC4069UBD NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-CDIP-T14
Logic IC Type INVERTER INVERTER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 145 ns 90 ns
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 6 V 15 V
Supply Voltage-Min (Vsup) 2 V 3 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 7 1
Load Capacitance (CL) 50 pF
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

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Compare HEC4069UBD with alternatives