88E1111-B0-BAB2C000
vs
VSC8514XMK-03
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MARVELL SEMICONDUCTOR INC
|
MICROSEMI CORP
|
Package Description |
LBGA,
|
QFN-138
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PBGA-B117
|
S-PBCC-B138
|
Length |
14 mm
|
12 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
117
|
138
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
HVBCC
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Seated Height-Max |
1.54 mm
|
0.85 mm
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Terminal Form |
BALL
|
BUTT
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
10 mm
|
12 mm
|
Base Number Matches |
1
|
2
|
Samacsys Manufacturer |
|
Microsemi Corporation
|
|
|
|
Compare 88E1111-B0-BAB2C000 with alternatives
Compare VSC8514XMK-03 with alternatives