88E1111-B0-NDC2C000
vs
88E1111-B2-BAB2C000-P123
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MARVELL SEMICONDUCTOR INC
|
MARVELL SEMICONDUCTOR INC
|
| Part Package Code |
QFN
|
|
| Package Description |
HBCC,
|
LBGA,
|
| Pin Count |
96
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
S-XBCC-B96
|
R-PBGA-B117
|
| Length |
9 mm
|
14 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
96
|
117
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HBCC
|
LBGA
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Seated Height-Max |
0.85 mm
|
1.54 mm
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Terminal Form |
BUTT
|
BALL
|
| Terminal Pitch |
0.6 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
9 mm
|
10 mm
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e1
|
| Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare 88E1111-B0-NDC2C000 with alternatives
Compare 88E1111-B2-BAB2C000-P123 with alternatives