89HT0816PYDBCGI
vs
89HT0816PYDBCGI8
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
CABGA
|
CABGA
|
| Package Description |
CABGA-196
|
CABGA-196
|
| Pin Count |
196
|
196
|
| Manufacturer Package Code |
BCG196
|
BCG196
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2019-12-19
|
2019-12-19
|
| Interface IC Type |
RETIMER
|
RETIMER
|
| JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B196
|
| JESD-609 Code |
e1
|
|
| Length |
15 mm
|
15 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
196
|
196
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VBGA
|
VBGA
|
| Package Equivalence Code |
BGA196,14X14,40
|
BGA196,14X14,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.76 mm
|
1.76 mm
|
| Supply Voltage-Max |
1.1 V
|
1.1 V
|
| Supply Voltage-Min |
0.95 V
|
0.95 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
15 mm
|
15 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare 89HT0816PYDBCGI with alternatives
Compare 89HT0816PYDBCGI8 with alternatives