933373600005
vs
CD4013BF3A
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTERSIL CORP
|
| Part Package Code |
WAFER
|
DIP
|
| Package Description |
DIE,
|
DIP, DIP14,.3
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
4000/14000/40000
|
|
| JESD-30 Code |
X-XUUC-N
|
R-XDIP-T14
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Number of Bits |
1
|
|
| Number of Functions |
2
|
2
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC
|
| Package Code |
DIE
|
DIP
|
| Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
IN-LINE
|
| Propagation Delay (tpd) |
220 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Position |
UPPER
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| fmax-Min |
20 MHz
|
|
| Base Number Matches |
1
|
4
|
| Rohs Code |
|
No
|
| Pin Count |
|
14
|
| JESD-609 Code |
|
e0
|
| Load Capacitance (CL) |
|
50 pF
|
| Max Frequency@Nom-Sup |
|
3500000 Hz
|
| Max I(ol) |
|
0.00035999999999999997 A
|
| Number of Terminals |
|
14
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Equivalence Code |
|
DIP14,.3
|
| Prop. Delay@Nom-Sup |
|
400 ns
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
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