933668750652
vs
74HC00D/S15,118
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
|
Part Package Code |
DIP
|
SOIC
|
Package Description |
DIP,
|
3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
|
Pin Count |
14
|
14
|
Reach Compliance Code |
unknown
|
|
HTS Code |
8542.39.00.01
|
|
Family |
HC/UH
|
|
JESD-30 Code |
R-PDIP-T14
|
|
JESD-609 Code |
e4
|
|
Length |
19.025 mm
|
|
Logic IC Type |
NAND GATE
|
|
Number of Functions |
4
|
|
Number of Inputs |
2
|
|
Number of Terminals |
14
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
DIP
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Propagation Delay (tpd) |
135 ns
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
4.2 mm
|
|
Supply Voltage-Max (Vsup) |
6 V
|
|
Supply Voltage-Min (Vsup) |
2 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
|
Technology |
CMOS
|
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
7.62 mm
|
|
Base Number Matches |
1
|
2
|
Manufacturer Package Code |
|
SOT108-1
|
|
|
|
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