933668750652 vs TC74HC00AF-EL feature comparison

933668750652 NXP Semiconductors

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TC74HC00AF-EL Toshiba America Electronic Components

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code DIP SOIC
Package Description DIP, SOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e4 e0
Length 19.025 mm 10.3 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 135 ns 19 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 1.9 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.3 mm
Base Number Matches 1 1
Load Capacitance (CL) 50 pF

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