933669150652 vs 74HC132D-Q100,118 feature comparison

933669150652 NXP Semiconductors

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74HC132D-Q100,118 Nexperia

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code DIP SOIC
Package Description DIP, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 215.8
CO2e (mg) 20219.441 2675.92
Family HCT HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e4 e4
Length 19.025 mm 8.65 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 50 ns 190 ns
Qualification Status Not Qualified
Seated Height-Max 4.2 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD SILVER
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 2
Manufacturer Package Code SOT108-1
ECCN Code EAR99
Samacsys Manufacturer Nexperia
Moisture Sensitivity Level 1
Packing Method TR, 13 INCH
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100
Time@Peak Reflow Temperature-Max (s) 30

Compare 933669150652 with alternatives

Compare 74HC132D-Q100,118 with alternatives