933669290652 vs MC74HC138ANG feature comparison

933669290652 NXP Semiconductors

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MC74HC138ANG onsemi

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ONSEMI
Part Package Code DIP DIP
Package Description DIP, DIP-16
Pin Count 16 16
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e4 e3
Length 21.6 mm 19.175 mm
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 225 ns 205 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.7 mm 4.44 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Samacsys Manufacturer onsemi
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP16,.3
Packing Method RAIL
Prop. Delay@Nom-Sup 41 ns

Compare 933669290652 with alternatives

Compare MC74HC138ANG with alternatives