933713360653 vs MM74HC00MX feature comparison

933713360653 NXP Semiconductors

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MM74HC00MX Fairchild Semiconductor Corporation

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Source Content uid 933713360653 MM74HC00MX
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC SOIC
Package Description SO-14 SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e3
Length 8.65 mm 8.6235 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 135 ns 113 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.753 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 2 4
Manufacturer Package Code 14LD,SOIC,JEDEC MS-012, .150", NARROW BODY
ECCN Code EAR99
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code SOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 23 ns
Schmitt Trigger NO
Time@Peak Reflow Temperature-Max (s) 30

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