933713380653 vs CD74HC74M feature comparison

933713380653 NXP Semiconductors

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CD74HC74M General Electric Solid State

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS GENERAL ELECTRIC SOLID STATE
Part Package Code SOIC
Package Description 3.90 MM, PLASTIC, MS-012AB, SOT-108-1, SO-14
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH
JESD-30 Code R-PDSO-G14
JESD-609 Code e4
Length 8.65 mm
Logic IC Type D FLIP-FLOP
Moisture Sensitivity Level 1
Number of Bits 1
Number of Functions 2
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 265 ns
Qualification Status Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type POSITIVE EDGE
Width 3.9 mm
fmax-Min 24 MHz
Base Number Matches 2 7

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