933835860005 vs 933713990652 feature comparison

933835860005 NXP Semiconductors

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933713990652 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DIE SOIC
Package Description DIE, PLASTIC, SO-20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-XUUC-N R-PDSO-G20
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Propagation Delay (tpd) 48 ns 48 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 18 MHz 18 MHz
Base Number Matches 1 2
Rohs Code Yes
Pin Count 20
JESD-609 Code e4
Length 12.8 mm
Moisture Sensitivity Level 1
Number of Terminals 20
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 2.65 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.5 mm

Compare 933835860005 with alternatives

Compare 933713990652 with alternatives