933835860025 vs 74HCT377PW feature comparison

933835860025 NXP Semiconductors

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74HCT377PW NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DIE TSSOP
Package Description DIE, TSSOP, TSSOP20,.25
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-XUUC-N R-PDSO-G20
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 48 ns 48 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 18 MHz 60 MHz
Base Number Matches 1 2
Pbfree Code Yes
Pin Count 20
Additional Feature WITH HOLD MODE
JESD-609 Code e4
Length 6.5 mm
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 22000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Terminals 20
Package Equivalence Code TSSOP20,.25
Seated Height-Max 1.1 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 0.65 mm
Width 4.4 mm

Compare 933835860025 with alternatives

Compare 74HCT377PW with alternatives