935171440112 vs SN74HC132DBRG4 feature comparison

935171440112 NXP Semiconductors

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SN74HC132DBRG4 Texas Instruments

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Source Content uid 935171440112 SN74HC132DBRG4
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code SSOP SSOP
Package Description SSOP, SSOP, SSOP14,.3
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e4
Length 6.2 mm 6.2 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 190 ns 156 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.3 mm 5.3 mm
Base Number Matches 2 1
Load Capacitance (CL) 50 pF
Max I(ol) 0.0052 A
Package Equivalence Code SSOP14,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supplies 2/6 V
Power Supply Current-Max (ICC) 0.02 mA
Prop. Delay@Nom-Sup 31 ns
Schmitt Trigger YES
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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