935174120112
vs
74HC00DB%2C112
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
|
| Part Package Code |
SSOP
|
|
| Package Description |
SSOP,
|
|
| Pin Count |
14
|
|
| Reach Compliance Code |
compliant
|
|
| HTS Code |
8542.39.00.01
|
|
| Family |
HC/UH
|
|
| JESD-30 Code |
R-PDSO-G14
|
|
| JESD-609 Code |
e4
|
|
| Length |
6.2 mm
|
|
| Logic IC Type |
NAND GATE
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
|
| Number of Inputs |
2
|
|
| Number of Terminals |
14
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SSOP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
135 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
5.3 mm
|
|
| Base Number Matches |
2
|
|
|
|
|
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