935186880118 vs 74HC157PW,112 feature comparison

935186880118 Nexperia

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74HC157PW,112 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description TSSOP, 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e4
Length 5 mm 5 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR, 13 INCH TUBE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 190 ns 38 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 4.4 mm 4.4 mm
Base Number Matches 2 2
Part Package Code TSSOP
Pin Count 16
Manufacturer Package Code SOT403-1
Factory Lead Time 4 Weeks
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code TSSOP16,.25
Prop. Delay@Nom-Sup 38 ns

Compare 935186880118 with alternatives

Compare 74HC157PW,112 with alternatives