935189850112 vs 74HCT253DB,112 feature comparison

935189850112 NXP Semiconductors

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74HCT253DB,112 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC SSOP1
Package Description SOT-338-1, SSOP-16 SOT-338-1, SSOP-16
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e4
Length 6.2 mm 6.2 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 4 4
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 57 ns 60 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 5.3 mm 5.3 mm
Base Number Matches 2 2
Manufacturer Package Code SOT338-1
Load Capacitance (CL) 50 pF
Max I(ol) 0.006 A
Package Equivalence Code SSOP16,.3
Packing Method TUBE
Prop. Delay@Nom-Sup 57 ns

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Compare 74HCT253DB,112 with alternatives