935209030112 vs 74LVT08DB,118 feature comparison

935209030112 NXP Semiconductors

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74LVT08DB,118 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SSOP SSOP1
Package Description 5.30 MM, PLASTIC, MO-150AB, SOT-337-1, SSOP-14 5.30 MM, PLASTIC, MO-150AB, SOT-337-1, SSOP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVT LVT
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e4
Length 6.2 mm 6.2 mm
Logic IC Type AND GATE AND GATE
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 4.8 ns 4.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 5.3 mm 5.3 mm
Base Number Matches 2 2
Manufacturer Package Code SOT337-1
Load Capacitance (CL) 50 pF
Max I(ol) 0.032 A
Package Equivalence Code SSOP14,.3
Packing Method TR
Power Supply Current-Max (ICC) 2 mA
Prop. Delay@Nom-Sup 4.6 ns
Schmitt Trigger NO

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