935220650512 vs TEA1118TD feature comparison

935220650512 NXP Semiconductors

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TEA1118TD NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.65 mm
Number of Functions 1 1
Number of Terminals 14 14
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min -25 °C -25 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Current-Max 1.4 mA 1.4 mA
Supply Voltage-Nom 2.9 V 2.9 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Telecom IC Type CORDLESS TELEPHONE BASEBAND CIRCUIT CORDLESS TELEPHONE BASEBAND CIRCUIT
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 2

Compare 935220650512 with alternatives

Compare TEA1118TD with alternatives