935251310112 vs 74LVC245APW feature comparison

935251310112 NXP Semiconductors

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74LVC245APW Philips Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code TSSOP
Package Description 4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20
Pin Count 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e4
Length 6.5 mm
Logic IC Type BUS TRANSCEIVER
Moisture Sensitivity Level 1
Number of Bits 1 8
Number of Functions 8 1
Number of Ports 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE WITH SERIES RESISTOR 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 9.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 1.2 V
Supply Voltage-Nom (Vsup) 2.7 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4.4 mm
Base Number Matches 2 3
Control Type COMMON CONTROL
Count Direction BIDIRECTIONAL
Max I(ol) 0.024 A
Package Equivalence Code TSSOP20,.25
Packing Method TUBE
Prop. Delay@Nom-Sup 8 ns

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