935260899118 vs IDT74LVC157APY feature comparison

935260899118 NXP Semiconductors

Buy Now Datasheet

IDT74LVC157APY Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code SSOP SOIC
Package Description 5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16 SSOP, SSOP16,.3
Pin Count 16 16
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e0
Length 6.2 mm 6.2 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 7.5 ns 5.9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 1.99 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 2.7 V
Supply Voltage-Nom (Vsup) 2.7 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.3 mm 5.3 mm
Base Number Matches 1 2
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Package Equivalence Code SSOP16,.3
Prop. Delay@Nom-Sup 5.2 ns

Compare 935260899118 with alternatives

Compare IDT74LVC157APY with alternatives