935262750115 vs SN74AHC1G02DCKRE4 feature comparison

935262750115 NXP Semiconductors

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SN74AHC1G02DCKRE4 Texas Instruments

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code SOIC SOIC
Package Description TSSOP, TSSOP, TSSOP5/6,.08
Pin Count 5 5
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AHC AHC/VHC/H/U/V
JESD-30 Code R-PDSO-G5 R-PDSO-G5
Length 2 mm 2 mm
Logic IC Type NOR GATE NOR GATE
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 14.5 ns 13 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1.25 mm
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Package Equivalence Code TSSOP5/6,.08
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 8.5 ns
Schmitt Trigger NO
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare 935262750115 with alternatives

Compare SN74AHC1G02DCKRE4 with alternatives