935265467112 vs 74AHC157BQ feature comparison

935265467112 NXP Semiconductors

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74AHC157BQ NXP Semiconductors

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC QFN
Package Description 3.90 MM, PLASTIC, MS-012, SOT-109-1, SO-16 HVQCCN, LCC16,.1X.14,20
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AHC AHC/VHC/H/U/V
JESD-30 Code R-PDSO-G16 R-PQCC-N16
JESD-609 Code e4 e4
Length 9.9 mm 3.5 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP HVQCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 16 ns 21.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 3.9 mm 2.5 mm
Base Number Matches 2 2
Load Capacitance (CL) 50 pF
Max I(ol) 0.008 A
Package Equivalence Code LCC16,.1X.14,20
Prop. Delay@Nom-Sup 11 ns

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Compare 74AHC157BQ with alternatives