Findchips: Compare 935268380115 vs 74LVC1G08GW-Q100,1

935268380115 vs 74LVC1G08GW-Q100,1 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Active
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Part Package Code	SOIC	TSSOP
Package Description	TSSOP,	1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1,TSSOP-5
Pin Count	5	5
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G5	R-PDSO-G5
Length	2 mm	2.05 mm
Logic IC Type	AND GATE	AND GATE
Number of Functions	1	1
Number of Inputs	2	2
Number of Terminals	5	5
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)	10.5 ns	10.5 ns
Qualification Status	Not Qualified
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	1.8 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	1.25 mm	1.25 mm
Base Number Matches	2	2
Rohs Code		Yes
Manufacturer Package Code		SOT353-1
JESD-609 Code		e3
Moisture Sensitivity Level		1
Packing Method		TR, 7 INCH
Peak Reflow Temperature (Cel)		260
Screening Level		AEC-Q100
Terminal Finish		TIN
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates