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935268675125 vs 74LVC1G175GM,115 feature comparison

935268675125 Nexperia

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74LVC1G175GM,115 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description TSSOP, 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G5 R-PDSO-N6
JESD-609 Code e3 e3
Length 2 mm 1.45 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 5 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSON
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR, 7 INCH TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 9.9 ns 17 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN TIN
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 1.25 mm 1 mm
fmax-Min 200 MHz 200 MHz
Base Number Matches 1 1
Part Package Code SON
Pin Count 6
Manufacturer Package Code SOT886
Factory Lead Time 4 Weeks
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 175000000 Hz
Max I(ol) 0.024 A
Package Equivalence Code SOLCC6,.04,20
Prop. Delay@Nom-Sup 7.5 ns
Logic » FF/Latches
Logic » FF/Latches

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Compare 74LVC1G175GM,115 with alternatives