935274507125
vs
935300912125
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
| Package Description |
VSSOP,
|
VSSOP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e4
|
|
| Length |
2.3 mm
|
2.2 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSSOP
|
VSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR, 7 INCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
11.4 ns
|
11.4 ns
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
2 mm
|
2 mm
|
| Base Number Matches |
2
|
2
|
| Screening Level |
|
AEC-Q100
|
|
|
|
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