935280866518 vs TLE8250XSJ feature comparison

935280866518 NXP Semiconductors

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TLE8250XSJ Infineon Technologies AG

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Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer NXP SEMICONDUCTORS INFINEON TECHNOLOGIES AG
Package Description SOP, SOP,
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.9 mm 5 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature Grade AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 4 mm
Base Number Matches 1 1
Rohs Code Yes
Date Of Intro 2016-07-18
Moisture Sensitivity Level 2A
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level AEC-Q100
Terminal Finish Nickel/Gold/Palladium (Ni/Au/Pd)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare 935280866518 with alternatives

Compare TLE8250XSJ with alternatives