935283238118 vs TLE6251DS feature comparison

935283238118 NXP Semiconductors

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TLE6251DS Infineon Technologies AG

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Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS INFINEON TECHNOLOGIES AG
Package Description SOP, PLASTIC, SO-8
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G14 R-PDSO-G8
Length 8.65 mm 5 mm
Number of Functions 1 1
Number of Terminals 14 8
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Screening Level AEC-Q100 AEC-Q100
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature Grade AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 4.4 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 8
Samacsys Manufacturer Infineon
Data Rate 1000 Mbps
Moisture Sensitivity Level 2A
Number of Transceivers 1
Package Equivalence Code SOP8,.25
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Supply Current-Max 0.07 mA
Terminal Finish Nickel/Gold/Palladium (Ni/Au/Pd)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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