935288608551 vs LPC1768FBD100,551 feature comparison

935288608551 NXP Semiconductors

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LPC1768FBD100,551 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description LFQFP, LQFP-100
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width
Bit Size 32 32
Clock Frequency-Max 25 MHz 25 MHz
DAC Channels YES YES
DMA Channels YES YES
External Data Bus Width
JESD-30 Code S-PQFP-G100 S-PQFP-G100
Length 14 mm 14 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 70 70
Number of Terminals 100 100
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.6 mm
Speed 100 MHz 100 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 2.4 V 2.4 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Part Package Code QFP
Pin Count 100
Manufacturer Package Code SOT407-1
ECCN Code 3A991.A.2
Samacsys Manufacturer NXP
Additional Feature PART, ROHS INFO AND SHIPPING METHOD CONSIDERED FROM MFR WEBSITE
CPU Family CORTEX-M3
JESD-609 Code e3
On Chip Program ROM Width 8
Package Equivalence Code QFP100,.63SQ,20
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 65536
ROM (words) 524288
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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