935289336118 vs 74CBTLV3125DS,118 feature comparison

935289336118 NXP Semiconductors

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74CBTLV3125DS,118 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description SSOP, 3.90 MM, 0.635 MM PITCH, PLASTIC, SOT519-1, SSOP-16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01
Family CBTLV/3B CBTLV/3B
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 4.9 mm 4.9 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 1 1
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 0.31 ns 0.31 ns
Seated Height-Max 1.73 mm 1.73 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.635 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 2 2
Rohs Code Yes
Part Package Code SSOP1
Pin Count 16
Manufacturer Package Code SOT519-1
Factory Lead Time 4 Weeks
Moisture Sensitivity Level 1
Package Equivalence Code SSOP16,.25
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) 30