935291729132
vs
SN74AUP1G34YZPR
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
Package Description |
SON,
|
GREEN, DSBGA-5
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
AUP/ULP/V
|
AUP/ULP/V
|
JESD-30 Code |
R-PDSO-N6
|
R-XBGA-B5
|
JESD-609 Code |
e3
|
e1
|
Length |
1 mm
|
1.4 mm
|
Logic IC Type |
BUFFER
|
BUFFER
|
Number of Functions |
1
|
1
|
Number of Inputs |
1
|
1
|
Number of Terminals |
6
|
5
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
SON
|
VFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Propagation Delay (tpd) |
20.1 ns
|
18.9 ns
|
Seated Height-Max |
0.35 mm
|
0.5 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
0.8 V
|
0.8 V
|
Supply Voltage-Nom (Vsup) |
1.1 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
TIN
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
NO LEAD
|
BALL
|
Terminal Pitch |
0.3 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Width |
0.9 mm
|
0.9 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
5
|
ECCN Code |
|
EAR99
|
Samacsys Manufacturer |
|
Texas Instruments
|
Load Capacitance (CL) |
|
30 pF
|
Max I(ol) |
|
0.004 A
|
Moisture Sensitivity Level |
|
1
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
BGA5,2X3,20
|
Packing Method |
|
TR
|
Peak Reflow Temperature (Cel) |
|
260
|
Power Supply Current-Max (ICC) |
|
0.0009 mA
|
Prop. Delay@Nom-Sup |
|
18.9 ns
|
Qualification Status |
|
Not Qualified
|
Schmitt Trigger |
|
NO
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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