935291729132 vs SN74AUP1G34YZPR feature comparison

935291729132 NXP Semiconductors

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SN74AUP1G34YZPR Texas Instruments

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Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Package Description SON, GREEN, DSBGA-5
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-N6 R-XBGA-B5
JESD-609 Code e3 e1
Length 1 mm 1.4 mm
Logic IC Type BUFFER BUFFER
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 6 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SON VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Propagation Delay (tpd) 20.1 ns 18.9 ns
Seated Height-Max 0.35 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish TIN Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form NO LEAD BALL
Terminal Pitch 0.3 mm 0.5 mm
Terminal Position DUAL BOTTOM
Width 0.9 mm 0.9 mm
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code BGA
Pin Count 5
ECCN Code EAR99
Samacsys Manufacturer Texas Instruments
Load Capacitance (CL) 30 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Package Equivalence Code BGA5,2X3,20
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.0009 mA
Prop. Delay@Nom-Sup 18.9 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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