935292889132
vs
74AUP1G34GW-Q100H
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
Package Description |
VSON,
|
TSSOP, TSSOP5/6,.08
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
|
Family |
AUP/ULP/V
|
AUP/ULP/V
|
JESD-30 Code |
S-PDSO-N6
|
R-PDSO-G5
|
JESD-609 Code |
e3
|
|
Length |
1 mm
|
2.05 mm
|
Logic IC Type |
BUFFER
|
BUFFER
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Inputs |
1
|
1
|
Number of Terminals |
6
|
5
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSON
|
TSSOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR, 7 INCH
|
TR
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
20.8 ns
|
20.8 ns
|
Seated Height-Max |
0.35 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
0.8 V
|
0.8 V
|
Supply Voltage-Nom (Vsup) |
1.1 V
|
1.1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
TIN
|
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.35 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1 mm
|
1.25 mm
|
Base Number Matches |
1
|
2
|
Part Package Code |
|
TSSOP
|
Pin Count |
|
5
|
Manufacturer Package Code |
|
SOT353-1
|
Load Capacitance (CL) |
|
30 pF
|
Max I(ol) |
|
0.0017 A
|
Package Equivalence Code |
|
TSSOP5/6,.08
|
Prop. Delay@Nom-Sup |
|
20.8 ns
|
Qualification Status |
|
Not Qualified
|
Schmitt Trigger |
|
NO
|
Screening Level |
|
AEC-Q100
|
|
|
|
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