935297573118
vs
TJA1050T/N1,112
feature comparison
Part Life Cycle Code |
Not Recommended
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
,
|
3.90 MM, ROHS COMPLIANT, PLASTIC, MS-012, SOT96-1, SOP-8
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Length |
4.9 mm
|
4.9 mm
|
Number of Functions |
1
|
1
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1.75 mm
|
1.75 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Width |
3.9 mm
|
3.9 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Part Package Code |
|
SOIC
|
Pin Count |
|
8
|
Manufacturer Package Code |
|
SOT96-1
|
Samacsys Manufacturer |
|
NXP
|
Data Rate |
|
1000 Mbps
|
JESD-30 Code |
|
R-PDSO-G8
|
JESD-609 Code |
|
e4
|
Moisture Sensitivity Level |
|
1
|
Number of Terminals |
|
8
|
Number of Transceivers |
|
1
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
SOP
|
Package Equivalence Code |
|
SOP8,.25
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max |
|
0.075 mA
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
|
GULL WING
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
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