935302721118
vs
HI-5115113PSI
feature comparison
| Part Life Cycle Code |
Not Recommended
|
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
|
| Package Description |
SOP,
|
|
| Reach Compliance Code |
unknown
|
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
R-PDSO-G8
|
|
| JESD-609 Code |
e4
|
|
| Length |
4.9 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SOP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
1
|
|
|
|
|
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