9FGV0631CKLF
vs
SI5335A-B08658-GMR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
SKYWORKS SOLUTIONS INC
|
| Part Package Code |
VFQFPN
|
|
| Package Description |
VFQFPN-40
|
QFN-24
|
| Pin Count |
40
|
|
| Manufacturer Package Code |
NDG40P2
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
CONFIGURATION CAN BE ACCOMPLISHED W/T STRAPPING PINS, SMBUS NOT REQUIRED FOR DEVICE CONTROL
|
ALSO OPERATES AT 2.5V AND 3.3V NOMINAL SUPPLY
|
| JESD-30 Code |
S-XQCC-N40
|
S-XQCC-N24
|
| JESD-609 Code |
e3
|
e4
|
| Length |
5 mm
|
4 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
40
|
24
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Clock Frequency-Max |
100 MHz
|
350 MHz
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Primary Clock/Crystal Frequency-Nom |
27 MHz
|
27 MHz
|
| Seated Height-Max |
1 mm
|
0.9 mm
|
| Supply Voltage-Max |
1.9 V
|
1.98 V
|
| Supply Voltage-Min |
1.7 V
|
1.71 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN
|
GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
5 mm
|
4 mm
|
| uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, PROCESSOR SPECIFIC
|
CLOCK GENERATOR, PROCESSOR SPECIFIC
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare 9FGV0631CKLF with alternatives
Compare SI5335A-B08658-GMR with alternatives