A3P060-QN132IY
vs
A3P060-VQG100I
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2016-03-25
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
Microchip
|
| Clock Frequency-Max |
|
350 MHz
|
| JESD-30 Code |
|
S-PQFP-G100
|
| JESD-609 Code |
|
e3
|
| Length |
|
14 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of CLBs |
|
1536
|
| Number of Equivalent Gates |
|
60000
|
| Number of Inputs |
|
71
|
| Number of Outputs |
|
71
|
| Number of Terminals |
|
100
|
| Operating Temperature-Max |
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
1536 CLBS, 60000 GATES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TFQFP
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Packing Method |
|
TRAY
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Supply Voltage-Max |
|
1.575 V
|
| Supply Voltage-Min |
|
1.425 V
|
| Supply Voltage-Nom |
|
1.5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
14 mm
|
|
|
|
Compare A3P060-QN132IY with alternatives
Compare A3P060-VQG100I with alternatives