A3P060-VQG100YI
vs
A3P060-FGG144YT
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROSEMI SOC PRODUCTS GROUP
|
| Part Package Code |
QFP
|
|
| Package Description |
TFQFP,
|
,
|
| Pin Count |
100
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQFP-G100
|
|
| Length |
14 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
1536
|
|
| Number of Equivalent Gates |
60000
|
|
| Number of Terminals |
100
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
1536 CLBS, 60000 GATES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TFQFP
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Max |
1.575 V
|
|
| Supply Voltage-Min |
1.425 V
|
|
| Supply Voltage-Nom |
1.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Width |
14 mm
|
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare A3P060-VQG100YI with alternatives
Compare A3P060-FGG144YT with alternatives