A3P060-VQG100YI vs A3P060-VQG100I feature comparison

A3P060-VQG100YI Microsemi FPGA & SoC

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A3P060-VQG100I Microchip Technology Inc

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Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP MICROCHIP TECHNOLOGY INC
Part Package Code QFP
Package Description TFQFP, 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100
Pin Count 100
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G100 S-PQFP-G100
Length 14 mm 14 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1536 1536
Number of Equivalent Gates 60000 60000
Number of Terminals 100 100
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1536 CLBS, 60000 GATES 1536 CLBS, 60000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFQFP TFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH FLATPACK, THIN PROFILE, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
Base Number Matches 1 2
Rohs Code Yes
Samacsys Manufacturer Microchip
Clock Frequency-Max 350 MHz
JESD-609 Code e3
Number of Inputs 71
Number of Outputs 71
Packing Method TRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30

Compare A3P060-VQG100YI with alternatives

Compare A3P060-VQG100I with alternatives