A3P1000-1FG484I vs A3P1000-1FG484II feature comparison

A3P1000-1FG484I Microsemi Corporation

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A3P1000-1FG484II Microchip Technology Inc

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Rohs Code No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Microsemi Corporation
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0
Length 23 mm 23 mm
Number of CLBs 24576 24576
Number of Equivalent Gates 1000000 1000000
Number of Terminals 484 484
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 23 mm
Base Number Matches 11 3

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