A3P1000-1FG484I vs A3P1000-1FGG256II feature comparison

A3P1000-1FG484I Microsemi Corporation

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A3P1000-1FGG256II Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description BGA, BGA,
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Microsemi Corporation
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B484 S-PBGA-B256
JESD-609 Code e0
Length 23 mm 17 mm
Number of CLBs 24576 24576
Number of Equivalent Gates 1000000 1000000
Number of Terminals 484 256
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 1.8 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 17 mm
Base Number Matches 11 3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30

Compare A3P1000-1FG484I with alternatives

Compare A3P1000-1FGG256II with alternatives