A3P1000-1FG484I vs A3P1000-FG144I feature comparison

A3P1000-1FG484I Microsemi Corporation

Buy Now Datasheet

A3P1000-FG144I Microchip Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Microsemi Corporation Microchip
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B484 S-PBGA-B144
JESD-609 Code e0 e0
Length 23 mm 13 mm
Number of CLBs 24576 24576
Number of Equivalent Gates 1000000 1000000
Number of Terminals 484 144
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 13 mm
Base Number Matches 11 8
Factory Lead Time 4 Weeks
Moisture Sensitivity Level 3
Number of Inputs 97
Number of Outputs 97
Package Equivalence Code BGA144,12X12,40
Packing Method TRAY
Peak Reflow Temperature (Cel) 235
Time@Peak Reflow Temperature-Max (s) 20

Compare A3P1000-1FG484I with alternatives

Compare A3P1000-FG144I with alternatives