A3P125-FGG144YT vs A3P125-QN132YI feature comparison

A3P125-FGG144YT Microsemi Corporation

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A3P125-QN132YI Microsemi FPGA & SoC

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI SOC PRODUCTS GROUP
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 1 1
Part Package Code QFP
Package Description QCCN,
Pin Count 132
JESD-30 Code S-XQCC-N132
Length 8 mm
Number of CLBs 3072
Number of Equivalent Gates 125000
Number of Terminals 132
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 3072 CLBS, 125000 GATES
Package Body Material UNSPECIFIED
Package Code QCCN
Package Shape SQUARE
Package Style CHIP CARRIER
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Width 8 mm

Compare A3P125-FGG144YT with alternatives

Compare A3P125-QN132YI with alternatives