A3P400-FGG256
vs
M1A3P400-FG144
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
8 Weeks
|
12 Weeks
|
Clock Frequency-Max |
350 MHz
|
350 MHz
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B144
|
JESD-609 Code |
e1
|
e0
|
Length |
17 mm
|
13 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
9216
|
9216
|
Number of Equivalent Gates |
400000
|
400000
|
Number of Inputs |
178
|
97
|
Number of Outputs |
178
|
97
|
Number of Terminals |
256
|
144
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
9216 CLBS, 400000 GATES
|
9216 CLBS, 400000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA144,12X12,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Packing Method |
TRAY
|
TRAY
|
Peak Reflow Temperature (Cel) |
250
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.8 mm
|
1.55 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD SILVER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
17 mm
|
13 mm
|
Base Number Matches |
12
|
6
|
Package Description |
|
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144
|
|
|
|
Compare A3P400-FGG256 with alternatives
Compare M1A3P400-FG144 with alternatives