A3PE1500-1FGG676
vs
M1A3PE1500-FGG676I
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676
|
27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
8 Weeks
|
12 Weeks
|
JESD-30 Code |
S-PBGA-B676
|
S-PBGA-B676
|
JESD-609 Code |
e1
|
e1
|
Length |
27 mm
|
27 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
38400
|
38400
|
Number of Equivalent Gates |
1500000
|
1500000
|
Number of Terminals |
676
|
676
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
38400 CLBS, 1500000 GATES
|
38400 CLBS, 1500000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA676,26X26,40
|
BGA676,26X26,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Packing Method |
TRAY
|
TRAY
|
Peak Reflow Temperature (Cel) |
250
|
250
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.44 mm
|
2.44 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
8
|
1
|
Clock Frequency-Max |
|
350 MHz
|
Number of Inputs |
|
444
|
Number of Logic Cells |
|
38400
|
Number of Outputs |
|
444
|
|
|
|
Compare A3PE1500-1FGG676 with alternatives
Compare M1A3PE1500-FGG676I with alternatives