A3PE1500-FFG484 vs M1A3PE1500-1FGG484 feature comparison

A3PE1500-FFG484 Microsemi Corporation

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M1A3PE1500-1FGG484 Microchip Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 38400 38400
Number of Equivalent Gates 1500000 1500000
Number of Inputs 280 280
Number of Logic Cells 38400 38400
Number of Outputs 280 280
Number of Terminals 484 484
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 38400 CLBS, 1500000 GATES 38400 CLBS, 1500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 23 mm
Base Number Matches 5 4
Factory Lead Time 12 Weeks
Packing Method TRAY
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30

Compare A3PE1500-FFG484 with alternatives

Compare M1A3PE1500-1FGG484 with alternatives