A3PE3000L-FG484I vs A3PE3000L-1FGG484 feature comparison

A3PE3000L-FG484I Microsemi Corporation

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A3PE3000L-1FGG484 Microchip Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, BGA484,22X22,40 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Microsemi Corporation Microchip
Clock Frequency-Max 250 MHz 250 MHz
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 75264 75264
Number of Equivalent Gates 3000000 3000000
Number of Inputs 341 341
Number of Logic Cells 75264 75264
Number of Outputs 341 341
Number of Terminals 484 484
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 75264 CLBS, 3000000 GATES 75264 CLBS, 3000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 23 mm
Base Number Matches 2 11
Factory Lead Time 8 Weeks
Packing Method TRAY
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30

Compare A3PE3000L-FG484I with alternatives

Compare A3PE3000L-1FGG484 with alternatives